Researchmoz added Most up-to-date research on "Thermal Scanning Probe Lithography: Continuing the Path to Semiconductor Miniaturization" to its huge collection of research reports.
New generations of electronic products, such as smartphones and wearable devices, are being confined in smaller and thinner packages and, consequently, integrated circuits (IC) are also becoming smaller in size while supporting a larger number of transistors to provide a greater number of features.
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Continuing the process of miniaturization, the semiconductor industry is currently introducing integrated circuits based on transistors with 10 nm-node technology and below. A node is defined as half the distance between two identical features in adjacent transistors (also known as the IC half-pitch).
According to the latest International Technology Roadmap for Semiconductors (ITRS), issued in 2015, the target node range for logic devices reached 10-11 nanometers in 2017. These ICs are currently being fabricated by Samsung Electronics (Suwon, South Korea) and Taiwan Semiconductor Manufacturing Co. (TSMCO Hsinchu, Taiwan) using a FinFET (FinFET is the acronym for Fin Field-effect Transistor) configuration. FinFET is a non-planar (i.e., three-dimensional) field effect transistor.
The next node, which started to be mass-produced in 2018, is 7-8 nm and is likely based on a LGAA (Lateral Gate All-around) configuration. By 2021, logic devices at the 5-6 nm nodes are projected to enter the market, and by then VGAA (Vertical Gate All-around) technology will be required to manufacture these devices.
LGAA and VGAA configurations are based on the use of horizontal and vertical nanowire arrays, respectively. Nanowires for LGAA transistors are being produced using top-down methods, whereas vertical nanowires for VGAA devices are being created using bottom-up techniques.
Therefore, as companies switch to the fabrication of devices below the 10-nm node, traditional processes used in semiconductor manufacturing will be gradually replaced by fabrication methods based on the utilization of nanostructures, such as nanowires and nanofilms, as well as processes that manipulate materials at the atomic and molecular scale."
"Report Includes:
- Technological highlights and market outlook of thermal scanning probe lithography (tSPL) as a mean to semiconductor miniaturization
- Insight into the role of tSPL process in diverse industry sectors, including electronics and optoelectronics; chemistry, biochemistry and healthcare; sensors and actuators; energy; and fabrication of 3D structures on transparent substrates etc.
- Summary of lithographic processes for creating electronic features using deposition technologies for ultrathin films
- An assessment of current trends, technology status, strengths and drawbacks, and emerging applications of tSPL at the industrial level"
Make an Enquiry of this report @ https://www.researchmoz.us/enquiry.php?type=E&repid=2168329
Table of Contents
Chapter 1 Technology Highlights and Market Outlook
On-going Miniaturization and Nanoelectronics
Fabrication of Nanostructures
Scanning Probe Lithography
Current Technology Status and Strengths of Thermal Scanning Probe Lithography
Current and Emerging Applications
Technology Drawbacks
Competing Technologies
Market Outlook
List of Tables
Table 1 : Deposition Technologies for Ultrathin Films, 2019
Table 2 : Lithographic Methods, 2019
Table 3 : Materials Processed, by Thermal Scanning Probe Lithography, 2019
Table 4 : Current and Emerging Applications, 2019
Table 5 : Global Market for Nanolithography Equipment, by Region, Through 2024
List of Figures
Figure 1 : From Microelectronics to Nanoelectronics
Figure 2 : Global Market Share for Nanolithography Equipment, by Region, 2024
About ResearchMoz
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New generations of electronic products, such as smartphones and wearable devices, are being confined in smaller and thinner packages and, consequently, integrated circuits (IC) are also becoming smaller in size while supporting a larger number of transistors to provide a greater number of features.
Enter your information below to receive a sample copy of this report @ https://www.researchmoz.us/enquiry.php?type=S&repid=2168329
Continuing the process of miniaturization, the semiconductor industry is currently introducing integrated circuits based on transistors with 10 nm-node technology and below. A node is defined as half the distance between two identical features in adjacent transistors (also known as the IC half-pitch).
According to the latest International Technology Roadmap for Semiconductors (ITRS), issued in 2015, the target node range for logic devices reached 10-11 nanometers in 2017. These ICs are currently being fabricated by Samsung Electronics (Suwon, South Korea) and Taiwan Semiconductor Manufacturing Co. (TSMCO Hsinchu, Taiwan) using a FinFET (FinFET is the acronym for Fin Field-effect Transistor) configuration. FinFET is a non-planar (i.e., three-dimensional) field effect transistor.
The next node, which started to be mass-produced in 2018, is 7-8 nm and is likely based on a LGAA (Lateral Gate All-around) configuration. By 2021, logic devices at the 5-6 nm nodes are projected to enter the market, and by then VGAA (Vertical Gate All-around) technology will be required to manufacture these devices.
LGAA and VGAA configurations are based on the use of horizontal and vertical nanowire arrays, respectively. Nanowires for LGAA transistors are being produced using top-down methods, whereas vertical nanowires for VGAA devices are being created using bottom-up techniques.
Therefore, as companies switch to the fabrication of devices below the 10-nm node, traditional processes used in semiconductor manufacturing will be gradually replaced by fabrication methods based on the utilization of nanostructures, such as nanowires and nanofilms, as well as processes that manipulate materials at the atomic and molecular scale."
"Report Includes:
- Technological highlights and market outlook of thermal scanning probe lithography (tSPL) as a mean to semiconductor miniaturization
- Insight into the role of tSPL process in diverse industry sectors, including electronics and optoelectronics; chemistry, biochemistry and healthcare; sensors and actuators; energy; and fabrication of 3D structures on transparent substrates etc.
- Summary of lithographic processes for creating electronic features using deposition technologies for ultrathin films
- An assessment of current trends, technology status, strengths and drawbacks, and emerging applications of tSPL at the industrial level"
Make an Enquiry of this report @ https://www.researchmoz.us/enquiry.php?type=E&repid=2168329
Table of Contents
Chapter 1 Technology Highlights and Market Outlook
On-going Miniaturization and Nanoelectronics
Fabrication of Nanostructures
Scanning Probe Lithography
Current Technology Status and Strengths of Thermal Scanning Probe Lithography
Current and Emerging Applications
Technology Drawbacks
Competing Technologies
Market Outlook
List of Tables
Table 1 : Deposition Technologies for Ultrathin Films, 2019
Table 2 : Lithographic Methods, 2019
Table 3 : Materials Processed, by Thermal Scanning Probe Lithography, 2019
Table 4 : Current and Emerging Applications, 2019
Table 5 : Global Market for Nanolithography Equipment, by Region, Through 2024
List of Figures
Figure 1 : From Microelectronics to Nanoelectronics
Figure 2 : Global Market Share for Nanolithography Equipment, by Region, 2024
About ResearchMoz
ResearchMoz is the one stop online destination to find and buy market research reports & Industry Analysis. We fulfill all your research needs spanning across industry verticals with our huge collection of market research reports. We provide our services to all sizes of organizations and across all industry verticals and markets. Our Research Coordinators have in-depth knowledge of reports as well as publishers and will assist you in making an informed decision by giving you unbiased and deep insights on which reports will satisfy your needs at the best price.
Contact Us:
ResearchMoz
Mr. Nachiket Ghumare,
Tel: +1-518-621-2074
Toll Free: 866-997-4948 (US-CANADA)
Email: sales@researchmoz.us
Follow us on LinkedIn @ bit.ly/1TBmnVG
Follow us on Blogger @ https://marketnewstoday24.blogspot.com/
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